C-plane Aluminum Nitride (AlN) Substrates
- High electric resistivity - 10+11- 10+13 0hm*cm
- High thermal conductivity - 3.2 W/cm*K
- Close lattice and thermal match with GaN (reduced epilayer cracking)
- Mechanically and chemically stable
- Low dislocation density – (in best 103 cm-2)
- Optically transparent piezoelectric with high surface
acoustic waves speed – 6*10^3 m/sec
Specification
| Diameter, mm |
15 ± 0.38 |
50.8 ± 0.38 |
| Thickness, mm |
0.4 ± 0.03 |
0.4 ± 0.03 |
| FWHM, arcsec |
<300 |
<300 |
| Surface orientation (0001), +/-deg |
<0.5 |
<0.5 |
| Al-face |
epi-ready |
epi-ready |
| Primary Flat Length, mm |
8 ± 2 |
16 ± 2 |
| Primary Flat orientation, +/-deg |
<11-20> ± 5 |
<11-20> ± 5 |
| Secondary Flat Length, mm |
4 ± 2 |
8 ± 2 |